8:30am-4:30pm, Wednesday and Thursday, June 5-6, 2019, Sheraton Albuquerque Airport Hotel, Albuquerque, NM
- Provide a basic knowledge of surface conditioning and cleaning processes and technologies used in the manufacture of ICs.
- Learn about the processes and equipment used for wet, plasma, and dry cleaning.
- Share an overview and comparison of established and new surface conditioning and cleaning techniques.
- Describe specific surface conditioning techniques including critical cleaning, photoresist stripping, post-CMP cleaning, megasonics, dilute chemistries, and the use of ozone.
- Understand of how cleans affect low-k dielectrics and copper and possible cleaning challenges for new BEOL materials.
This two-day course will provide a working knowledge of surface conditioning and cleaning techniques used in the manufacture of integrated circuits (IC). Fundamental processes and practical methods in cleaning the wafer surfaces will be described.
Upon completing this course participants will have an understanding of all types of cleaning processes used in IC manufacturing: surface conditioning for pre-diffusion clean; in particular pre-gate oxide clean; post-etch and post-implant photoresist removal; particle removal; and post-CMP cleans. Participants will understand cleaning roadmaps and limitations of clean technologies as feature sizes decrease and can make informed decisions on the surface conditioning and cleaning processes and techniques utilized in IC manufacturing.
Who Should Attend?
The intended participants are engineers, technologists, or managers who provide clean and contamination free technologies for IC manufacturing including semiconductor manufacturing process engineers, process development engineers, and integration engineers, IC equipment application and process engineers, and IC clean chemical process engineers.
Instructor: Rick Reidy, Professor of Materials Science and Engineering, University of North Texas
Rick Reidy is a University Distinguished Teaching Professor and professor of Materials Science and Engineering at the University of North Texas. He has over thirty years experience in materials processing and characterization. His research in semiconductor materials includes novel cleans, low-k dielectrics, and supercritical processing. He spent two summers working at Texas Instruments in interconnect development, and had a collaborative grant with TI through the National Science Foundation (2003-2007). For ten years (2004-2014), he was a member of the International Technology Roadmap for Semiconductors (ITRS) Front End Processes- Surface Preparation Technical Working Group. In 2011, he co-edited of the Handbook of Cleaning in Semiconductor Manufacturing with Karen Reinhardt of Cameo Consulting. He has published over 80 technical research papers and holds three US patents. Dr. Reidy received his B.A. in Chemistry and Biochemistry from Rice University, and an M.S. and Ph.D. in Metals Science and Engineering from Penn State.
Course Notes will be provided.