Photolithography Process in IC Production


8:30am-4:30pm, Wednesday, May 17, 2017, Sheraton Albuquerque Airport Hotel, Albuquerque, NM

Course Objectives

  • Become familiar with the optical lithography process.
  • Understand a baseline lithography process, variables and their effects.
  • Learn the advantages and disadvantages of g-line, i-line, DUV, e-beam, and other alternative patterning techniques.
  • Understand the relationship between resolution, focus, and wavelength used for exposure.

Course Description

The course begins with a brief overview and introduction of electronic devices, design rules, and the important role lithography plays in integrated-circuit fabrication. It then provides a detailed description of current photolithography practices for IC production. The emphasis is on a baseline process, taking a wafer through the lithographic sequence step by step. Variables and alternative methods are discussed in detail.

Exposure equipment is compared in terms of optics, resolution, focus, and throughput capabilities. Masks/reticles (binary and PSM) and pellicles are described and issues regarding them are presented. Other topics covered include light sources, alignment, interference effects (standing waves), mix-and-match, OPC, OAI, defects, and metrology.

Throughout the presentation, the history of each step is briefly included so attendees understand where we have come from, where we are now, and the direction the industry is headed.

Attendees will learn how the resist mask is used in subsequent etching, ion implantation, and additive processes and how the resist is finally removed without damage to delicate structures being fabricated.

Many of the process tips described will be immediately useful in understanding and improving an existing lithography process. To encourage postcourse learning, web addresses of lithography equipment and material suppliers is provided. Also included is a list of industry publications (some at no cost) and how to subscribe.

Who Should Attend?

Engineers, scientists, technicians, and others working in the semiconductor industry who want to understand the lithography process used to produce integrated circuits.

Instructor:  John Frankenthaler, Consultant, F&F Associates

John Frankenthaler has been a consultant for over 20 years on photolithography, materials, processes and alternative imaging strategies. At Shipley Company (purchased by Rohm and Haas, DOW), he was directly involved with developing, manufacturing, and supporting commercial lithographic products. Prior to this he was a member of the technical staff at Texas Instruments working on yield improvements. Previous to that he held engineering positions at IBM focusing on new manufacturing technology. His company, F&F ASSOCIATES consults on microelectronic and printed circuit chemicals, lithographic processes, materials and equipment.

Mr. Frankenthaler earned a B.S. in engineering and chemistry from Stevens Institute of Technology, an M.S. in organic and analytical chemistry from MIT, and an M.E.A. from Syracuse University.

Course Materials

Course Notes

Cost:  $690.00

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