Surface Analysis & Depth Profiling

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A Comprehensive Course on Surface Analysis by X-Ray Photoelectron Spectroscopy (XPS or ESCA), Auger Electron Spectroscopy (AES), Focused Ion Beam Analysis (FIB) and Secondary Ion Mass Spectroscopy (SIMS)

Course Objectives

  • Become familiar with the principles of these four materials analysis techniques
  • You learn the relative capabilities (and limitations) of the techniques, and their principle applications

Course Description

This course is a combination of the two one-day courses, XPS/Auger and FIB/SIMS, which are offered separately (see course descriptions). The combination provides attendees with a comprehensive treatment of the most generally useful surface analysis methods at a significantly discounted cost compared to taking the three courses separately.
The emphasis is on understanding the physical principles of the techniques, the basics of the instruments, the uses for elemental and chemical state analysis (both qualitative and quantitative) and the lateral and depth resolution capabilities of each technique. Many illustrative examples are given across a range of materials.

Who Should Attend?

Scientists, engineers, technicians, and others who desire a practical, current understanding of XPS, AES, FIB, and SIMS.

Instructors

C.R. Brundle C.R. Brundle and Associates
Fred Stevie North Carolina State University, Senior Researcher

Course Materials

Course Notes

Cost

$850.00 (2-days) (XPS/ESCA and AES plus FIB and SIMS)

Christopher Richard (Dick) Brundle obtained his Ph.D. in physical chemistry (London, and Oxford) in 1967, working in the early development of UV Photoelectron Spectroscopy (UPS), studying small molecules. After a postdoc period at Bell Labs, he was a lecturer in physical chemistry at Bradford University, UK, from 1970 to 1975, where he developed and implemented the first UHV X-Ray Photoelectron Spectroscopy (XPS) capability for surface studies. In 1975 he moved to IBM Research, San Jose, working in basic research (adsorption and reaction at metal and semiconductor surfaces), applications, and technical management in surface and thin-film analytical methods. In 1993 he formed his own consulting company and in 1998 joined Applied Materials as director of the Defect and Thin-Film Characterization Laboratory, where his work concentrated on methodology for root cause analysis for particle defects on full wafers, and on developing methods for analysis and characterization of ultra-thin films. In 2003 he returned to consulting. He has over 150 publications, was editor of the Journal of Electron Spectroscopy for 25 years, and is senior editor of the book “Encyclopedia of Materials Characterization.” He has had a long association with the AVS, having served twice as the Chair of the Northern California Chapter, and has received two AVS major technical awards.

Fred Stevie is a Senior Researcher at the Analytical Instrumentation Facility in North Carolina State University and is responsible for SIMS and XPS analyses. His experience with materials characterization using ion beams and mass spectrometry spans more than 25 years, principally with Bell Laboratories at Murray Hill, New Jersey, Allentown, Pennsylvania, and Orlando, Florida. He has authored or co-authored more than 150 publications, including a book on SIMS. His contributions to the SIMS field cover a range of topics including quantification, surface roughening effects, interfacial contaminants, and insulator analysis. FIB interests include sample preparation for TEM, particularly using the lift-out method, and FIB-SIMS. He has also a research professor of Materials Science at the University of Central Florida. He is active in technical organizations, particularly the American Vacuum Society and the SIMS Workshop Series. He received a M.S. degree in physics from Vanderbilt University in 1970.