Surface, Interface and Thin Film Analysis

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8:30am-4:30pm, Tuesday-Wednesday, May 19-20, 2015, Marriott Uptown, Albuquerque, NM

Course Objectives

  • Learn the fundamentals and practical aspects of using the major surface, interface, and thin film analysis spectroscopic techniques.
  • Understand and be able to interpret the data provided by each technique.
  • Know the comparative usage and limitations of each technique.

Course Description

This course is for those wanting a good understanding of the practical usage of the major spectroscopic analytical methods used for determining atomic and chemical composition and, in some cases, structural information at the surfaces and interfaces of materials, and through thin films.

The major techniques covered are x-ray photoelectron spectroscopy (XPS, or electron spectroscopy for chemical analysis [ESCA]), Auger electron spectroscopy (AES, including scanning Auger microscopy [SAM]), secondary ion mass spectroscopy (SIMS), and Rutherford backscattering spectroscopy (RBS). The principles of each technique are given, followed by specific examples of practical applications (particularly to semiconductor, data storage, and thin-film material situations).

A comparison is made of the information content provided; the differences in surface sensitivity, spatial resolution, etc.; and the cost and ease of obtaining the information. If time allows, a few of the lesser used techniques will also be reviewed. The aim is to provide enough knowledge to be able to choose and use the techniques to answer surface, interface, and thin film analytical questions. It is not intended, however, to be an instrument operation training course.

Who Should Attend?

Anyone with a need to understand, in some depth, what information these analytical techniques can provide and how to get it. This would include scientists and students working in surface-related fields, process engineers and managers with responsibilities for surface- or interface-related technologies, and technicians working with these techniques.

Instructor: C.R. Brundle, C.R. Brundle and Associates

Christopher Richard (Dick) Brundle¬†obtained his Ph.D. in physical chemistry (London, and Oxford) in 1967, working in the early development of UV Photoelectron Spectroscopy (UPS), studying small molecules. After a postdoc period at Bell Labs, he was a lecturer in physical chemistry at Bradford University, UK, from 1970 to 1975, where he developed and implemented the first UHV X-Ray Photoelectron Spectroscopy (XPS) capability for surface studies. In 1975 he moved to IBM Research, San Jose, working in basic research (adsorption and reaction at metal and semiconductor surfaces), applications, and technical management in surface and thin-film analytical methods. In 1993 he formed his own consulting company and in 1998 joined Applied Materials as director of the Defect and Thin-Film Characterization Laboratory, where his work concentrated on methodology for root cause analysis for particle defects on full wafers, and on developing methods for analysis and characterization of ultra-thin films. In 2003 he returned to consulting. He has over 150 publications, was editor of the Journal of Electron Spectroscopy for 25 years, and is senior editor of the book “Encyclopedia of Materials Characterization.” He has had a long association with the AVS, having served twice as the Chair of the Northern California Chapter, and has received two AVS major technical awards.

Course Materials

Course Notes

Cost:  $850.00

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